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Fracture of silicon wafers

✍ Scribed by J.C. McLaughlin; A.F.W. Willoughby


Publisher
Elsevier Science
Year
1987
Tongue
English
Weight
609 KB
Volume
85
Category
Article
ISSN
0022-0248

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πŸ“œ SIMILAR VOLUMES


Biaxial Fracture Test of Silicon Wafers
✍ C. Funke; E. Kullig; M. Kuna; H.J. MΓΆller πŸ“‚ Article πŸ“… 2004 πŸ› John Wiley and Sons 🌐 English βš– 203 KB

The statistical fracture stress distribution of silicon wafers was obtained by biaxial plate bending tests in combination with finite element calculations. For the correct interpretation of these tests it is important that the finite element calculations imply wafer thickness and elastic properties