Biaxial Fracture Test of Silicon Wafers
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C. Funke; E. Kullig; M. Kuna; H.J. MΓΆller
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Article
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2004
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John Wiley and Sons
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English
β 203 KB
The statistical fracture stress distribution of silicon wafers was obtained by biaxial plate bending tests in combination with finite element calculations. For the correct interpretation of these tests it is important that the finite element calculations imply wafer thickness and elastic properties