Rotational grinding of silicon wafersβsu
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Atte Haapalinna; Saulius Nevas; Dietmar PΓ€hler
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Article
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2004
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Elsevier Science
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English
β 557 KB
Industrial practise in wafer manufacturing indicates that there is not one agreed method available to acquire a conclusive picture of the sub-surface damage, defined as structural inhomogeneities of the crystal lattice. Therefore, various methods have been studied and compared for measurement of the