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Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size

โœ Scribed by Woong Ho Bang; Choong-Un Kim; Suk Hoon Kang; Kyu Hwan Oh

Book ID
107455553
Publisher
Springer US
Year
2009
Tongue
English
Weight
488 KB
Volume
38
Category
Article
ISSN
0361-5235

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