✦ LIBER ✦

Formation of interfacial microstructure in brazing of Si3N4 with Ti-activated Ag-Cu filler alloys

✍ Scribed by M. Paulasto; J.K. Kivilahti

Book ID: 116164933
Publisher: Elsevier Science
Year: 1995
Weight: 513 KB
Volume: 32
Category: Article
ISSN: 0956-716X
DOI: 10.1016/0956-716x(95)00127-h

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Interfacial microstructure of Si3N4/Si3N

Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

✍ J. Zhang; X.M. Zhang; Y. Zhou; M. Naka; Atroshenko Svetlana 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 709 KB

Interfacial microstructure of the Si3N4/

Interfacial microstructure of the Si3N4/Si3N4 joint brazed with Cu–Pd–Ti filler alloy

✍ J. Zhang; Y. Zhou; M. Naka 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 859 KB

Brazing of Si3N4 by Active Cu-Ga-Ti Fill

Brazing of Si3N4 by Active Cu-Ga-Ti Filler Alloys

✍ A. A. Prokopenko; V. S. Zhuravlev; Y. V. Naidich 📂 Article 📅 1998 🏛 Springer 🌐 English ⚖ 82 KB

Interfacial microstructure of Si3N4/Si3N

Interfacial microstructure of Si3N4/Si3N4joint brazed using Au–Ni–V filler alloy

✍ J. Zhang; Y. Sun; C. F. Liu; H. W. Zhang 📂 Article 📅 2009 🏛 Springer 🌐 English ⚖ 424 KB

Direct brazing of Si3N4-steel joint usin

Direct brazing of Si3N4-steel joint using Ag-28Cu brazing filler metal with Ti interlayer

✍ Al-Ping Xian; Zhong-Yao Si 📂 Article 📅 1991 🏛 Springer 🌐 English ⚖ 539 KB

Effect of Ti content on microstructure a

Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu–Pd–Ti filler metals

✍ C.F. Liu; J. Zhang; Y. Zhou; Q.C. Meng; M. Naka 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 655 KB

A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin