✦ LIBER ✦

Fluxless wafer bonding with Sn-rich Sn–Au dual-layer structure

✍ Scribed by Jongsung Kim; Chin C. Lee

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Fluxless silicon-to-alumina bonding usin

✍ Jong S. Kim; Won S. Choi; Dongwook Kim; Andrei Shkel; Chin C. Lee 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 934 KB

Fluxless Bonding of Large Silicon Chips

✍ Pin J. Wang; Jong S. Kim; Chin C. Lee 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 514 KB

Bonding of Cu-based high aspect ratio mi

✍ Fanghua Mei; Ke Chen; B. Lu; Wen Jin Meng 📂 Article 📅 2009 🏛 Springer-Verlag 🌐 English ⚖ 444 KB

[IEEE 53rd Electronic Components and Tec

✍ Dongwook Kim, ; Chin C. Lee, ; Sokolowski, W.M. 📂 Article 📅 2003 🏛 IEEE ⚖ 401 KB

New Metal-Rich Sulfides Ni6SnS2 and Ni9S

✍ A. I. Baranov; A. A. Isaeva; L. Kloo; B. A. Popovkin 📂 Article 📅 2003 🏛 John Wiley and Sons ⚖ 76 KB 👁 1 views

## Abstract For Abstract see ChemInform Abstract in Full Text.

New Metal-Rich Sulfides Ni 6 SnS 2 and N

✍ Baranov, A. I.; Isaeva, A. A.; Kloo, L.; Popovkin, B. A. 📂 Article 📅 2003 🏛 American Chemical Society 🌐 English ⚖ 268 KB