Fluxless silicon-to-alumina bonding using electroplated Au–Sn–Au structure at eutectic composition

✍ Scribed by Jong S. Kim; Won S. Choi; Dongwook Kim; Andrei Shkel; Chin C. Lee

• Book ID: 103842339
• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 934 KB
• Volume: 458
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2006.12.106