Fluxless Bonding of Large Silicon Chips to Ceramic Packages Using Electroplated Eutectic Au/Sn/Au Structures

✍ Scribed by Pin J. Wang; Jong S. Kim; Chin C. Lee

• Book ID: 107455571
• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 514 KB
• Volume: 38
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-009-0861-9