✦ LIBER ✦

Fluxless tin bonding of silicon chips to iron substrates

✍ Scribed by Shou-Jen Hsu, Chin C. Lee

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Fluxless bonding of silicon wafers to mo

✍ Pin J. Wang; Jong S. Kim; Dongwook Kim; Chin C. Lee 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 467 KB

Fluxless Bonding of Large Silicon Chips

✍ Pin J. Wang; Jong S. Kim; Chin C. Lee 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 514 KB

Low-Temperature Solid-State Silver Bondi

✍ Chu-Hsuan Sha; Lee, C.C. 📂 Article 📅 2011 🏛 Institute of Electrical and Electronics Engineers 🌐 English ⚖ 1004 KB

Low-Temperature Bonding of Laser Diode C

✍ Higurashi, E.; Imamura, T.; Suga, T.; Sawada, R. 📂 Article 📅 2007 🏛 IEEE 🌐 English ⚖ 598 KB

Palladium-catalysed addition of tintin

✍ Terence N. Mitchell; Ulrich Schneider 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 503 KB

Bonding of maxillofacial silicone elasto

✍ Muhanad M. Hatamleh; David C. Watts 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 367 KB