✦ LIBER ✦

Fine grinding of silicon wafers

✍ Scribed by Z.J Pei; Alan Strasbaugh

Publisher: Elsevier Science
Year: 2001
Tongue: English
Weight: 406 KB
Volume: 41
Category: Article
ISSN: 0890-6955
DOI: 10.1016/s0890-6955(00)00101-2

No coin nor oath required. For personal study only.

✦ Synopsis

Silicon wafers are used for the production of most microchips. Various processes are needed to transfer a silicon crystal ingot into wafers. As one of such processes, surface grinding of silicon wafers has attracted attention among various investigators and a limited number of articles can be found in the literature. However, no published articles are available regarding fine grinding of silicon wafers. In this paper, the uniqueness and the special requirements of the silicon wafer fine grinding process are introduced first. Then some experimental results on the fine grinding of silicon wafers are presented and discussed. Tests on different grinding wheels demonstrate the importance of choosing the correct wheel and an illustration of the proper selection of process parameters is included. Also discussed are the effects of the nozzle position and the flow rate of the grinding coolant.

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