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Fine grinding of silicon wafers: designed experiments

✍ Scribed by Z.J Pei; Alan Strasbaugh

Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
445 KB
Volume
42
Category
Article
ISSN
0890-6955

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✦ Synopsis

Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure to develop cost-effective processes to manufacture silicon wafers. Fine grinding possesses great potential to reduce the overall cost for manufacturing silicon wafers. The uniqueness and the special requirements of fine grinding have been discussed in a paper published earlier in this journal. As a follow-up, this paper presents the results of a designed experimental investigation into fine grinding of silicon wafers. In this investigation, a three-variable two-level full factorial design is employed to reveal the main effects as well as the interaction effects of three process parameters (wheel rotational speed, chuck rotational speed and feedrate). The process outputs studied include grinding force, spindle motor current, cycle time, surface roughness and grinding marks.

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