๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Fatigue resistance of soldered joints: A methodological study

โœ Scribed by H.W. Anselm Wiskott; Jack I. Nicholls; Urs C. Belser


Book ID
113233719
Publisher
Elsevier Science
Year
1994
Tongue
English
Weight
789 KB
Volume
10
Category
Article
ISSN
0109-5641

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


A study on the electrical resistance of
โœ De-Shin Liu; Chin-Yu Ni ๐Ÿ“‚ Article ๐Ÿ“… 2002 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 722 KB

A BGA package warping produced hybrid deformations in the solder joint interconnections. This situation creates difficult challenges in avoiding certain mechanical failure problems and even maintaining acceptable electrical performance in the electronic package. Accessing electronic circuit simulati