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Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

✍ Scribed by P. S. Andry; C. K. Tsang; B. C. Webb; E. J. Sprogis; S. L. Wright; B. Dang; D. G. Manzer

Book ID: 125502494
Publisher: IBM
Year: 2008
Tongue: English
Weight: 996 KB
Volume: 52
Category: Article
ISSN: 0018-8646
DOI: 10.1147/JRD.2008.5388558

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