✦ LIBER ✦

Fabrication and characterization of PECVD silicon nitride for RF MEMS applications

✍ Scribed by H. U. Rahman, B. C. Johnson, J. C. Mccallum, E. Gauja, R. Ramer

Book ID: 118787746
Publisher: Springer-Verlag
Year: 2012
Tongue: English
Weight: 476 KB
Volume: 19
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s00542-012-1522-0

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Silicon Nitride Films Deposited by RF Sp

Silicon Nitride Films Deposited by RF Sputtering for Microstructure Fabrication in MEMS

✍ Vivekanand Bhatt; Sudhir Chandra 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 819 KB

New applications of low temperature PECV

New applications of low temperature PECVD silicon nitride films for microelectronic device fabrication

✍ M.D. Dange; J.Y. Lee; K. Sooriakumar 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 393 KB

Electrical characterization of MIS capac

Electrical characterization of MIS capacitors fabricated from ECR-PECVD silicon oxide and silicon nitride bilayer films

✍ H. Castán; S. Dueñas; J. Barbolla; E. San Andrés; A. Del Prado; I. Mártil; G. Go 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 735 KB

Characterization and comparison of PECVD

Characterization and comparison of PECVD silicon nitride and silicon oxynitride dielectric for MIM capacitors

✍ Ng, C.H.; Chew, K.W.; Chu, S.F. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 317 KB

Fabrication and characterization of stre

Fabrication and characterization of stress-free microbeams for MEMS applications

✍ V. I. Shashkin; N. V. Vostokov; E. A. Vopilkin; A. Yu. Klimov; V. M. Daniltsev; 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 398 KB

Young’s modulus and residual stress of D

Young’s modulus and residual stress of DF PECVD silicon nitride for MEMS free-standing membranes

✍ E. Cianci; A. Coppa; V. Foglietti 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 481 KB

This paper addresses the simultaneous determination of the Young's modulus and the residual stress of thin silicon nitride films deposited by dual frequency plasma enhanced chemical vapour deposition, to be used in the fabrication of free-standing MEMS membranes. Load-deflection tests of circular me