✦ LIBER ✦

EVG's low temperature plasma bonding chamber

Publisher: Elsevier Science
Year: 2004
Tongue: English
Weight: 169 KB
Volume: 17
Category: Article
ISSN: 0961-1290
DOI: 10.1016/s0961-1290(04)00333-3

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Low-temperature silicon wafer bonding

✍ H.J. Quenzer; W. Benecke 📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 987 KB

PVDF sensors with low-temperature bondin

PVDF sensors with low-temperature bonding techniques

✍ S. Webster; T.D. Binnie 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 397 KB

Low-Temperature Plasma and Fullerenes

✍ G. A. Dyuzhev 📂 Article 📅 2010 🏛 John Wiley and Sons ⚖ 24 KB

N+ plasma-assisted wafer bonding between

N+ plasma-assisted wafer bonding between silicon and chemical vapor deposition oxide at low temperature

✍ Xiaobo Ma; Weili Liu; Chao Chen; Jiayi Xu; Zhitang Song; Chenglu Lin 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 567 KB

Atmospheric-pressure plasma pretreatment

Atmospheric-pressure plasma pretreatment for direct bonding of silicon wafers at low temperatures

✍ M. Eichler; B. Michel; M. Thomas; M. Gabriel; C.-P. Klages 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 631 KB

Using dielectric barrier discharges at atmospheric pressure, silicon wafers have been treated for lowtemperature direct wafer bonding with annealing temperatures down to 100 °C. The experimental setup and the bond procedure are described and the influences of different experimental parameters, such

Low-temperature silicon direct bonding a

Low-temperature silicon direct bonding and interface behaviours

✍ Jiwei Jiao; Deren Lu; Bin Xiong; Weiyuan Wang 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 413 KB