The etching of Pb(Zr Ti )O (PZT) thin films was performed using HBr /Ar gas in an inductively coupled plasma. The etch rate and etch profile of the PZT films were investigated as a function of the gas concentration of the HBr /Ar mixture. In addition, the etch parameters, including coil power, dc b
Etch characteristics of gallium indium zinc oxide thin films in a HBr/Ar plasma
β Scribed by Eun Ho Kim; Yu Bin Xiao; Seon Mi Kong; Chee Won Chung
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 877 KB
- Volume
- 205
- Category
- Article
- ISSN
- 0257-8972
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β¦ Synopsis
Gallium indium zinc oxide
High density plasma etching HBr/Ar Oxide thin film transistor Gallium indium zinc oxide (GIZO) thin films patterned with a photoresist (PR) were dry etched using inductively coupled plasma (ICP) of HBr/Ar gas. The etch rate of the GIZO films and the etch selectivity of GIZO/PR decreased gradually as HBr gas was added to Ar. In addition, the etch rate increased with increasing ICP power and dc-bias voltage to the substrate. However, the etch rate was decreased with increasing gas pressure. X-ray photoelectron spectroscopy and atomic force microscopy revealed Br compounds on the film surface during the etching process. It can be concluded that the high density plasma etching of GIZO films using HBr/Ar gas follows a sputtering etching mechanism with the assistance of a chemical reaction on the films.
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