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Electropotential-stimulated wear of copper during chemical mechanical planarization

✍ Scribed by Milind Kulkarni; Dedy Ng; Melloy Baker; Hong Liang; Robert Her

Book ID: 108299580
Publisher: Elsevier Science
Year: 2007
Tongue: English
Weight: 543 KB
Volume: 263
Category: Article
ISSN: 0043-1648
DOI: 10.1016/j.wear.2006.12.028

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