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Chemical mechanical planarization of copper bumps on printed circuit board

โœ Scribed by MoonKi Jeong; SeungJae Jo; HyunSeop Lee; AhReum Lee; ChungYun Kang; JinWon Choi; JinHo Kim; HaeDo Jeong

Book ID
107662334
Publisher
Korean Society for Precision Engineering
Year
2011
Tongue
English
Weight
272 KB
Volume
12
Category
Article
ISSN
1229-8557

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๐Ÿ“œ SIMILAR VOLUMES

Optical ellipsometry and electron spectr
Optical ellipsometry and electron spectroscopy studies of copper oxidation related to copper on printed circuit boards
โœ A. Manara; V. Sirtori; L. Mammarella ๐Ÿ“‚ Article ๐Ÿ“… 1992 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 751 KB

## Abstract The aim of the present work was to investigate the oxidation of pure copper samples and of those cut out from circuit boards by using optical ellipsometry XPS and AES, in order to establish whether ellipsometry alone could be used as a simple, economical means for routine analysis at th