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Electromigration studies on Sn(Cu) alloy lines

✍ Scribed by C. C. Lu; S. J. Wang; C. Y. Liu

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Electromigration in Line-Type Cu/Sn-Bi/C

✍ X. Gu; Y.C. Chan 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 419 KB

Electromigration Study on Sn(Cu) Solder/

✍ S.H. Wu, Y.J. Hu, C.T. Lu, T.S. Huang, Y.H. Chang, C.Y. Liu 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 459 KB

Effect of electromigration on intermetal

✍ L.D. Chen; M.L. Huang; S.M. Zhou 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 966 KB

Electromigration Failure Mechanism in Sn

✍ Ming-Hui Chu, S.W. Liang, Chih Chen, Annie T. Huang 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 764 KB

Electromigration effect on solder bump i

✍ Kimihiro Yamanaka; Yutaka Tsukada; Katsuaki Suganuma 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 298 KB

Electromigration studies of flip chip Sn

✍ T. L. Shao; K. C. Lin; Chih Chen 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 714 KB