✦ LIBER ✦

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

✍ Scribed by L.D. Chen; M.L. Huang; S.M. Zhou

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Abnormal polarity effect of electromigra

✍ X.F. Zhang; J.D. Guo; J.K. Shang 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 277 KB

Effect of intermetallic compound formati

✍ C. N. Liao; C. T. Wei 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 739 KB

The Influence of Sn Orientation on Inter

✍ Linares, Xioranny; Kinney, Chris; Lee, Kyu-Oh; Morris, J. W. 📂 Article 📅 2013 🏛 Springer US 🌐 English ⚖ 819 KB

Effect of Bismuth on Intermetallic Compo

✍ T.Y. Kang; Y.Y. Xiu; L. Hui; J.J. Wang; W.P. Tong; C.Z. Liu 📂 Article 📅 2011 🏛 Allerton Press Inc 🌐 English ⚖ 469 KB

Temperature Effect on Intermetallic Comp

✍ Gi-Tae Lim; Byoung-Joon Kim; Kiwook Lee; Jaedong Kim; Young-Chang Joo; Young-Bae 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 529 KB

Effects of Electromigration on Interfaci

✍ X.F. Zhang; J.D. Guo; J.K. Shang 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 364 KB