✦ LIBER ✦
The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration
✍ Scribed by Linares, Xioranny; Kinney, Chris; Lee, Kyu-Oh; Morris, J. W.
- Book ID
- 121583114
- Publisher
- Springer US
- Year
- 2013
- Tongue
- English
- Weight
- 819 KB
- Volume
- 43
- Category
- Article
- ISSN
- 0361-5235
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