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Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect

✍ Scribed by X.F. Zhang; J.D. Guo; J.K. Shang


Book ID
113896788
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
277 KB
Volume
57
Category
Article
ISSN
1359-6462

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Polarity effect of electromigration on i
✍ Yu-Dong Lu; Xiao-Qi He; Yun-Fei En; Xin Wang; Zhi-Qiang Zhuang 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 695 KB

The polarity effect of electromigration on the interfacial reactions of micro ball grid array (lBGA) solder joints was studied in terms of microstructural evolution. A dummy lBGA package with the same pair of solder joints was used to obtain reproducible results for a practical application. The lBGA