Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid–solid electromigration

✍ Scribed by Huang, M. L.; Zhou, Q.; Zhao, N.; Liu, X. Y.; Zhang, Z. J.

• Book ID: 121592830
• Publisher: Springer
• Year: 2013
• Tongue: English
• Weight: 845 KB
• Volume: 49
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-013-7862-z