✦ LIBER ✦

Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization

✍ Scribed by T. L. Shao; K. C. Lin; Chih Chen

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Electromigration study in SnAg3.8Cu0.7 s

✍ Ying-Chao Hsu; Tung-Liang Shao; Ching-Jung Yang; Chih Chen 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 665 KB

Interfacial reactions and compound forma

✍ Chien-Sheng Huang; Guh-Yaw Jang; Jeng-Gong Duh 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 800 KB

Metallurgical reaction of the Sn-3.5Ag s

✍ Chien-Sheng Huang; Jenq-Gong Duh; Yen-Ming Chen 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 152 KB

elemental redistribution and interfacial

✍ Guh-Yaw Jang; Jenq-Gong Duh 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 584 KB

Influence of Cu content on compound form

✍ Guh-Yaw Jang; Jeng-Gong Duh; Hideyuki Takahashi; Szu-Wei Lu; Jen-Chuan Chen 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 492 KB

Reaction Mechanism and Mechanical Proper

✍ Chung-Nan Peng; Jenq-Gong Duh 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 858 KB