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Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices

✍ Scribed by Lutum, R.; Heck, S.; Scheuerlein, C.


Book ID
121704621
Publisher
IEEE
Year
2013
Tongue
English
Weight
934 KB
Volume
23
Category
Article
ISSN
1051-8223

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A BGA package warping produced hybrid deformations in the solder joint interconnections. This situation creates difficult challenges in avoiding certain mechanical failure problems and even maintaining acceptable electrical performance in the electronic package. Accessing electronic circuit simulati