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Effects of process parameters on bondability in ultrasonic ball bonding

✍ Scribed by Jun Qi; Ngar Chun Hung; Ming Li; Deming Liu

Book ID
113895688
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
268 KB
Volume
54
Category
Article
ISSN
1359-6462

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In situ measurement of bond resistance v
In situ measurement of bond resistance varying with process parameters during ultrasonic wedge bonding
✍ Hongjun Ji; Mingyu Li; Chunqing Wang; Han Sur Bang; Hee Seon Bang πŸ“‚ Article πŸ“… 2009 πŸ› Elsevier Science 🌐 English βš– 888 KB

Interconnection joints are the signal and power carriers for chip-to-package, and their electrical property determines the whole component/device performances. With the process parameters (P, F and t) varying, the bond resistance was in situ measured during ultrasonic bonding. The influence of the p