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Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

✍ Scribed by Yong Ding; Jang-Kyo Kim; Pin Tong

Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 544 KB
Volume: 38
Category: Article
ISSN: 0167-6636
DOI: 10.1016/j.mechmat.2005.05.007

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