Role of process parameters on bondability and pad damage indicators in copper ball bonding

✍ Scribed by I. Qin; A. Shah; C. Huynh; M. Meyer; M. Mayer; Y. Zhou

• Book ID: 108210871
• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 943 KB
• Volume: 51
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2010.04.001