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Effects of ultrasonic bonding parameters on reliability of flip chip GaN-based light emitting diode

โœ Scribed by Lian-qiao Yang; Fang Yuan; Jian-hua Zhang

Book ID
107482889
Publisher
Chinese Electronic Periodical Services
Year
2011
Tongue
English
Weight
480 KB
Volume
15
Category
Article
ISSN
1007-6417

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