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Effects of Contact Area on Mechanical Strength, Electrical Resistance, and Electromigration Reliability of Cu/Low-k Interconnects

✍ Scribed by Yang, C.-C.; Shaw, T.; Simon, A.; Edelstein, D.

Book ID: 118069246
Publisher: The Electrochemical Society
Year: 2010
Tongue: English
Weight: 738 KB
Volume: 13
Category: Article
ISSN: 1099-0062
DOI: 10.1149/1.3373524

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