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Effects of annealing and interlayers on the adhesion energy of copper thin films to SiO2/Si substrates

✍ Scribed by M.D. Kriese; N.R. Moody; W.W. Gerberich

Book ID
108492240
Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
338 KB
Volume
46
Category
Article
ISSN
1359-6454

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