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Evaluation of copper thin film on SiO2/Si substrates by dynamic ultramicroindentation, SEM and AFM

✍ Scribed by Chi Fo Tsang; Hui Kim Hui

Publisher: John Wiley and Sons
Year: 2000
Tongue: English
Weight: 621 KB
Volume: 29
Category: Article
ISSN: 0142-2421
DOI: 10.1002/1096-9918(200011)29:11<735::aid-sia920>3.0.co;2-o

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