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Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder

✍ Scribed by Jing, Yanxia; Sheng, Guangmin; Huang, Zhenhua; Zhao, Guoji

Book ID
121601707
Publisher
Springer US
Year
2013
Tongue
English
Weight
349 KB
Volume
24
Category
Article
ISSN
0957-4522

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Effect of indium content and rapid solid
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✍ R. M. Shalaby 📂 Article 📅 2010 🏛 John Wiley and Sons 🌐 English ⚖ 145 KB 👁 1 views

## Abstract The Sn‐Zn alloys have been considered as lead‐free solders. In this paper, the effect of 0.0, 0.5, 1.0, 1.5 and 2.0 wt.% Indium as ternary additions on melting temperature, structure, microhardness and micro‐creep of the Sn‐9Zn lead‐free solders were investigated. It is shown that the a