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Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration

✍ Scribed by Y.L. Lin; Y.S. Lai; Y.W. Lin; C.R. Kao

Book ID: 107455030
Publisher: Springer US
Year: 2007
Tongue: English
Weight: 369 KB
Volume: 37
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-007-0293-3

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