Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

✍ Scribed by Liang, S. W.; Chang, Y. W.; Shao, T. L.; Chen, Chih; Tu, K. N.

• Book ID: 121710951
• Publisher: American Institute of Physics
• Year: 2006
• Tongue: English
• Weight: 401 KB
• Volume: 89
• Category: Article
• ISSN: 0003-6951
• DOI: 10.1063/1.2220550