Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature

✍ Scribed by Nah, J. W.; Suh, J. O.; Tu, K. N.

• Book ID: 121691661
• Publisher: American Institute of Physics
• Year: 2005
• Tongue: English
• Weight: 913 KB
• Volume: 98
• Category: Article
• ISSN: 0021-8979
• DOI: 10.1063/1.1949719