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Effect of the combination of surface finishes and solder balls on JEDEC drop reliability of chip-scale packages

โœ Scribed by Tong Hong Wang; Chung-Hung Tsai; Yi-Shao Lai


Book ID
116741940
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
925 KB
Volume
98
Category
Article
ISSN
0167-9317

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