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Effect of solidification on solder bump formation in solder jet process: Simulation and experiment

โœ Scribed by De-wen TIAN; Chun-qing WANG; Yan-hong TIAN


Book ID
117693638
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
902 KB
Volume
18
Category
Article
ISSN
1003-6326

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