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Effect of Sn Grain Orientation on the Cu6Sn5Formation in a Sn-Based Solder Under Current Stressing

✍ Scribed by Lin, Chih-Fan; Lee, Shang-Hua; Chen, Chih-Ming

Book ID: 113087128
Publisher: The Minerals, Metals & Materials Society
Year: 2012
Tongue: English
Weight: 354 KB
Volume: 43
Category: Article
ISSN: 1073-5623
DOI: 10.1007/s11661-012-1276-4

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