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The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction

✍ Scribed by Tseng, Chien-Fu; Duh, Jenq-Gong

No coin nor oath required. For personal study only.

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