Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint

✍ Scribed by Hongwen He, Liqiang Cao, Lixi Wan, Haiyan Zhao, Guangchen Xu, Fu Guo

• Book ID: 118303711
• Publisher: The Korean Institute of Metals and Materials
• Year: 2012
• Tongue: English
• Weight: 491 KB
• Volume: 8
• Category: Article
• ISSN: 1738-8090
• DOI: 10.1007/s13391-012-2019-9