✦ LIBER ✦

Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints

✍ Scribed by Y.W. Chang; S.H. Chiu; Chih Chen; D.J. Yao

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Effect of Al trace dimension on electrom

✍ S. H. Chiu; Chih Chen; D. J. Yao 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 191 KB

Effect of Al-Trace Width on the Electrom

✍ S. W. Liang; H. Y. Hsiao; Chih Chen 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 770 KB

Current-crowding-induced electromigratio

✍ Yeh, Everett C. C.; Choi, W. J.; Tu, K. N.; Elenius, Peter; Balkan, Haluk 📂 Article 📅 2002 🏛 American Institute of Physics 🌐 English ⚖ 549 KB

Effect of UBM Thickness on the Mean Time

✍ Y.L. Lin; Y.S. Lai; Y.W. Lin; C.R. Kao 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 369 KB

Effect of surface finish on the failure

✍ Y. L. Lin; Y. S. Lai; C. M. Tsai; C. R. Kao 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 374 KB

Secondary Current Crowding Effect during

✍ J.W. Jang; L.N. Ramanathan; J. Tang; D.R. Frear 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 303 KB