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Effect of oxygen inclusion on microstructure and thermal stability of copper nitride thin films

✍ Scribed by Du, Y.; Huang, R.; Song, R.; Ma, L.B.; Liu, C.; Li, C.R.; Cao, Z.X.

Book ID
120053241
Publisher
Cambridge University Press
Year
2007
Tongue
English
Weight
614 KB
Volume
22
Category
Article
ISSN
0884-2914

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Hall effect of copper nitride thin films
Hall effect of copper nitride thin films
✍ Yue, G. H. ;Liu, J. Z. ;Li, M. ;Yuan, X. M. ;Yan, P. X. ;Liu, J. L. πŸ“‚ Article πŸ“… 2005 πŸ› John Wiley and Sons 🌐 English βš– 236 KB

## Abstract The Hall effect of copper nitride (Cu~3~N) thin films was investigated in our work. Cu~3~N films were deposited on glass substrates by radio‐frequency (RF) magnetron sputtering at different temperatures using pure copper as the sputtering target. The Hall coefficients of the films are d