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Thermal stability of copper on Te–Ti thin films

✍ Scribed by Roos, Benjamin; Das, Sayantan; Alford, T.L.

Book ID: 121907142
Publisher: Elsevier Science
Year: 2013
Tongue: English
Weight: 461 KB
Volume: 113
Category: Article
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2013.09.083

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