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Effect of Moisture Content on the Bulk and Wall Constitutive Behaviour of Starch Pastes

✍ Scribed by K. Pruvost; G.M. Corfield; S. Kingman; C.J. Lawrence

Book ID
115031417
Publisher
Institution of Chemical Engineers
Year
1998
Tongue
English
Weight
197 KB
Volume
76
Category
Article
ISSN
0960-3085

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Wall-slip plays an important role in the flow behaviour of solder paste materials. The wall-slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin liquid layer