✦ LIBER ✦

Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

✍ Scribed by Sanapala, R.; Sood, B.; Das, D.; Pecht, M.

Book ID: 119816566
Publisher: IEEE
Year: 2009
Tongue: English
Weight: 1015 KB
Volume: 32
Category: Article
ISSN: 1521-334X
DOI: 10.1109/tepm.2009.2029566

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Simulated thermal cycling of surface com

Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tin–lead solder

✍ K. Pitt; G. Goldspink 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 104 KB

Lead-Free Solders: Materials Reliability

Lead-Free Solders: Materials Reliability for Electronics (Subramanian/Lead-Free Solders: Materials Reliability for Electronics) || ‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints’

✍ Subramanian, K. N. 📂 Article 📅 2012 🏛 John Wiley & Sons, Ltd 🌐 English ⚖ 633 KB

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al

[IEEE International Symposium on Advance

[IEEE International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (11-14 March 2001)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) - Moisture absorption in no-flow underfill materials and its effect on interfacial adhesion to solder mask coated FR4 printed wiring board

✍ Ferguson, T.P.; Jianmin Qu, 📂 Article 📅 2001 🏛 IEEE ⚖ 578 KB

AIP Conference Proceedings [American Ins

AIP Conference Proceedings [American Institute of Physics ADVANCED MATERIALS AND NANOTECHNOLOGY: Proceedings of the International Conference (AMN‐4) - Dunedin (New Zealand) (8–12 February 2009)] - Effect of Heat Treatment Conditions on Properties of Lead‐Free Bi2GeO5 Ferroelectric Glass Ceramics

✍ Kantha, P.; Pengpat, K.; Rujijanagul, G.; Tunkasiri, T.; Eitssayeam, S.; Intatha 📂 Article 📅 2009 🏛 American Institute of Physics ⚖ 828 KB

[IEEE 1999 Proceedings. 49th Electronic

[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

✍ Lau, J.H.; Lee, S.-W.R.; Chang, C.; Ouyang, C. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 915 KB