✦ LIBER ✦
Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tin–lead solder
✍ Scribed by K. Pitt; G. Goldspink
- Book ID
- 111591032
- Publisher
- Springer US
- Year
- 2004
- Tongue
- English
- Weight
- 104 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0957-4522
No coin nor oath required. For personal study only.