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Effect of grain boundary failure on fatigue life of high-lead SnPb solder

✍ Scribed by Vaynman, S.; Fine, M.E.

Book ID
121922815
Publisher
Elsevier Science
Year
1990
Weight
121 KB
Volume
24
Category
Article
ISSN
0956-716X

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✍ Hong Gao; Xu Chen 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 415 KB

Multiaxial fatigue tests were conducted on Sn-3.5Ag solder specimens under axial/torsional loading at room temperature. It was found that the ratcheting strain increased while the fatigue life decreased with the increase of axial stress and shear strain amplitude. A power relationship of ratcheting