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Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates

โœ Scribed by C. C. Chang; Y. W. Lin; Y. S. Lai; C. R. Kao

Book ID
107455575
Publisher
Springer US
Year
2009
Tongue
English
Weight
916 KB
Volume
38
Category
Article
ISSN
0361-5235

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๐Ÿ“œ SIMILAR VOLUMES

Effect of the cooling rate on the mechan
Effect of the cooling rate on the mechanical and electrical behaviour of a 63Sn/37Pb solder bump on a metallized Si substrate
โœ Bi-Shiou Chiou; Jen-Chiun Cheng ๐Ÿ“‚ Article ๐Ÿ“… 1994 ๐Ÿ› Springer US ๐ŸŒ English โš– 497 KB

Flip-chip bonding technology, with solder bumps deposited on metal terminals on the chip, provides the highest functional densities of all the present bonding techniques. In this study, tin-lead solder bumps were screen printed onto a metallized Si substrate. Various cooling rates were employed afte