Effect of grain boundary failure on the fatigue life of high-lead SnPb solders: Vaynman, S. and Fine, M.E. Scr. Metall. Mater. Sept. 1990 24, (9), 1737–1739

• Book ID: 103541985
• Publisher: Elsevier Science
• Year: 1991
• Tongue: English
• Weight: 172 KB
• Volume: 13
• Category: Article
• ISSN: 0142-1123
• DOI: 10.1016/0142-1123(91)90625-9