Failure behavior of small outline J Lead/Sn–X (X = AgCu or Pb) solder joints under thermomechanical fatigue test

✍ Scribed by Pei-Lin Wu; Meng-Kuang Huang; Chiapyng Lee; Shyh-Rong Tzan

• Book ID: 113780905
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 734 KB
• Volume: 87
• Category: Article
• ISSN: 0254-0584
• DOI: 10.1016/j.matchemphys.2004.05.044